Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming
نویسندگان
چکیده
منابع مشابه
Tailoring femtosecond 1.5-μm Bessel beams for manufacturing high-aspect-ratio through-silicon vias
Three-dimensional integrated circuits (3D ICs) are an attractive replacement for conventional 2D ICs as high-performance, low-power-consumption, and small-footprint microelectronic devices. However, one of the major remaining challenges is the manufacture of high-aspect-ratio through-silicon vias (TSVs), which is a crucial technology for the assembly of 3D Si ICs. Here, we present the fabricati...
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ژورنال
عنوان ژورنال: Advances in Manufacturing
سال: 2013
ISSN: 2095-3127,2195-3597
DOI: 10.1007/s40436-013-0039-9